Plastic three-dimensional circuit carrier innovation process

With the renewal of technology, molded interconnect devices have abandoned conventional circuit boards and have applied conductor tracks and electronic components directly to devices. Therefore, a complex assembly can be miniaturized, while the number of individual components can be greatly reduced by the integration function. Laser Direct Structuring (LDS) is an innovative process for producing molded interconnect devices, developed by LPKF Laser & Electronics AG (LPKF Laser & Electronics AG).

The Pocan® Polyester product developed by LANXESS for the LDS process can effectively control all steps in the entire process, from raw material selection and injection molding, to laser etching, metallization, and if required soldering processes such as Pocan® DPT7140LDS Ideal for high temperature applications, it has a heat deflection temperature (Bf) of 250°C and is therefore suitable for reflow and steam welding processes. The Pocan® DP7102 is an economical injection molder for distortion-free molded interconnects with excellent surface texture. The material has good flow characteristics, thus ensuring high productivity.

This technology can attach conductor tracks to thermoplastic circuit carriers, making circuit design modifications simple, economical, and flexible and without the use of corrosive chemicals. The electrical/electronic component industry is taking advantage of LDS technology.

Ralf Jantz, a LDS expert in LANXESS's semi-crystalline product division, said: “This technology has given us great potential in automotive engineering. For example, it can be applied to drive shaft encoders, sensor housings, brakes, and controller housings. , steering wheel module and electronic lock system."